---
OA_place: publisher
OA_type: hybrid
_id: '21810'
abstract:
- lang: eng
text: The next-generation semiconductors and devices, such as halide perovskites
and flexible electronics, are extremely sensitive to water, thus demanding highly
effective protection that not only seals out water in all forms (vapor, droplet,
and ice), but simultaneously provides mechanical flexibility, durability, transparency,
and self-cleaning. Although various solid-state encapsulation methods have been
developed, no strategy is available that can fully meet all the above requirements.
Here, we report a bioinspired liquid-based encapsulation strategy that offers
protection from water without sacrificing the operational properties of the encapsulated
materials. Using halide perovskite as a model system, we show that damage to the
perovskite from exposure to water is drastically reduced when it is coated by
a polymer matrix with infused hydrophobic oil. With a combination of experimental
and simulation studies, we elucidated the fundamental transport mechanisms of
ultralow water transmission rate that stem from the ability of the infused liquid
to fill-in and reduce defects in the coating layer, thus eliminating the low-energy
diffusion pathways, and to cause water molecules to diffuse as clusters, which
act together as an excellent water permeation barrier. Importantly, the presence
of the liquid, as the central component in this encapsulation method provides
a unique possibility of reversing the water transport direction; therefore, the
lifetime of enclosed water-sensitive materials could be significantly extended
via replenishing the hydrophobic oils regularly. We show that the liquid encapsulation
platform presented here has high potential in providing not only water protection
of the functional device but also flexibility, optical transparency, and self-healing
of the coating layer, which are critical for a variety of applications, such as
in perovskite solar cells and bioelectronics.
article_number: e2308804120
article_processing_charge: Yes (in subscription journal)
article_type: original
author:
- first_name: Baptiste
full_name: Lemaire, Baptiste
last_name: Lemaire
- first_name: Yanhao
full_name: Yu, Yanhao
last_name: Yu
- first_name: Nicola
full_name: Molinari, Nicola
last_name: Molinari
- first_name: Haichao
full_name: Wu, Haichao
last_name: Wu
- first_name: Zachary A. H.
full_name: Goodwin, Zachary A. H.
last_name: Goodwin
- first_name: Friedrich J
full_name: Stricker, Friedrich J
id: 7aca2cfc-46cf-11f0-abd3-8c96b5186745
last_name: Stricker
- first_name: Boris
full_name: Kozinsky, Boris
last_name: Kozinsky
- first_name: Joanna
full_name: Aizenberg, Joanna
last_name: Aizenberg
citation:
ama: Lemaire B, Yu Y, Molinari N, et al. Flexible fluid-based encapsulation platform
for water-sensitive materials. Proceedings of the National Academy of Sciences.
2023;120(34). doi:10.1073/pnas.2308804120
apa: Lemaire, B., Yu, Y., Molinari, N., Wu, H., Goodwin, Z. A. H., Stricker, F.
J., … Aizenberg, J. (2023). Flexible fluid-based encapsulation platform for water-sensitive
materials. Proceedings of the National Academy of Sciences. National Academy
of Sciences. https://doi.org/10.1073/pnas.2308804120
chicago: Lemaire, Baptiste, Yanhao Yu, Nicola Molinari, Haichao Wu, Zachary A. H.
Goodwin, Friedrich J Stricker, Boris Kozinsky, and Joanna Aizenberg. “Flexible
Fluid-Based Encapsulation Platform for Water-Sensitive Materials.” Proceedings
of the National Academy of Sciences. National Academy of Sciences, 2023. https://doi.org/10.1073/pnas.2308804120.
ieee: B. Lemaire et al., “Flexible fluid-based encapsulation platform for
water-sensitive materials,” Proceedings of the National Academy of Sciences,
vol. 120, no. 34. National Academy of Sciences, 2023.
ista: Lemaire B, Yu Y, Molinari N, Wu H, Goodwin ZAH, Stricker FJ, Kozinsky B, Aizenberg
J. 2023. Flexible fluid-based encapsulation platform for water-sensitive materials.
Proceedings of the National Academy of Sciences. 120(34), e2308804120.
mla: Lemaire, Baptiste, et al. “Flexible Fluid-Based Encapsulation Platform for
Water-Sensitive Materials.” Proceedings of the National Academy of Sciences,
vol. 120, no. 34, e2308804120, National Academy of Sciences, 2023, doi:10.1073/pnas.2308804120.
short: B. Lemaire, Y. Yu, N. Molinari, H. Wu, Z.A.H. Goodwin, F.J. Stricker, B.
Kozinsky, J. Aizenberg, Proceedings of the National Academy of Sciences 120 (2023).
date_created: 2026-05-06T10:49:51Z
date_published: 2023-08-14T00:00:00Z
date_updated: 2026-05-11T07:26:52Z
day: '14'
ddc:
- '540'
doi: 10.1073/pnas.2308804120
extern: '1'
external_id:
pmid:
- '37579173'
has_accepted_license: '1'
intvolume: ' 120'
issue: '34'
keyword:
- water permeability
- photoelectronic materials
- device encapsulation
- liquid-infused polymers
language:
- iso: eng
license: https://creativecommons.org/licenses/by-nc-nd/4.0/
main_file_link:
- open_access: '1'
url: https://doi.org/10.1073/pnas.2308804120
month: '08'
oa: 1
oa_version: Published Version
pmid: 1
publication: Proceedings of the National Academy of Sciences
publication_identifier:
eissn:
- 1091-6490
issn:
- 0027-8424
publication_status: published
publisher: National Academy of Sciences
quality_controlled: '1'
scopus_import: '1'
status: public
title: Flexible fluid-based encapsulation platform for water-sensitive materials
tmp:
image: /images/cc_by_nc_nd.png
legal_code_url: https://creativecommons.org/licenses/by-nc-nd/4.0/legalcode
name: Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
(CC BY-NC-ND 4.0)
short: CC BY-NC-ND (4.0)
type: journal_article
user_id: 2DF688A6-F248-11E8-B48F-1D18A9856A87
volume: 120
year: '2023'
...