{"isi":1,"acknowledgement":"We thank the reviewers for the valuable feedback. We also thank the Miba Machine Shop at ISTA, PCBWay, and PragoBoard for helping us with fabrication and assembly. This project was supported by the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation program (Grant Agreement No. 715767 – MATERIALIZABLE).","article_type":"original","oa":1,"oa_version":"Submitted Version","publication_status":"published","has_accepted_license":"1","file":[{"creator":"dernst","date_updated":"2023-06-19T11:02:23Z","content_type":"application/pdf","date_created":"2023-06-19T11:02:23Z","file_id":"13156","file_name":"2023_ACMToG_Freire.pdf","success":1,"relation":"main_file","access_level":"open_access","checksum":"a0b0ba3b36f43a94388e8824613d812a","file_size":78940724},{"access_level":"open_access","checksum":"b9206bbb67af82df49b7e7cdbde3410c","file_size":34345905,"creator":"dernst","date_updated":"2023-06-20T12:20:51Z","content_type":"application/pdf","date_created":"2023-06-20T12:20:51Z","success":1,"relation":"main_file","file_id":"13157","file_name":"2023_ACMToG_SuppMaterial_Freire.pdf"}],"intvolume":"        42","_id":"13049","title":"PCBend: Light up your 3D shapes with foldable circuit boards","department":[{"_id":"GradSch"},{"_id":"BeBi"}],"date_created":"2023-05-22T08:37:04Z","keyword":["PCB design and layout","Mesh geometry models"],"volume":42,"date_updated":"2024-01-29T10:30:49Z","month":"07","type":"journal_article","year":"2023","article_number":"142","ddc":["006"],"author":[{"full_name":"Freire, Marco","last_name":"Freire","first_name":"Marco"},{"first_name":"Manas","id":"FF8FA64C-AA6A-11E9-99AD-50D4E5697425","last_name":"Bhargava","full_name":"Bhargava, Manas","orcid":"0009-0007-6138-6890"},{"id":"2B14B676-F248-11E8-B48F-1D18A9856A87","first_name":"Camille","last_name":"Schreck","full_name":"Schreck, Camille"},{"first_name":"Pierre-Alexandre","last_name":"Hugron","full_name":"Hugron, Pierre-Alexandre"},{"id":"49876194-F248-11E8-B48F-1D18A9856A87","first_name":"Bernd","full_name":"Bickel, Bernd","last_name":"Bickel","orcid":"0000-0001-6511-9385"},{"full_name":"Lefebvre, Sylvain","last_name":"Lefebvre","first_name":"Sylvain"}],"doi":"10.1145/3592411","acknowledged_ssus":[{"_id":"M-Shop"}],"citation":{"ama":"Freire M, Bhargava M, Schreck C, Hugron P-A, Bickel B, Lefebvre S. PCBend: Light up your 3D shapes with foldable circuit boards. <i>Transactions on Graphics</i>. 2023;42(4). doi:<a href=\"https://doi.org/10.1145/3592411\">10.1145/3592411</a>","ieee":"M. Freire, M. Bhargava, C. Schreck, P.-A. Hugron, B. Bickel, and S. Lefebvre, “PCBend: Light up your 3D shapes with foldable circuit boards,” <i>Transactions on Graphics</i>, vol. 42, no. 4. Association for Computing Machinery, 2023.","chicago":"Freire, Marco, Manas Bhargava, Camille Schreck, Pierre-Alexandre Hugron, Bernd Bickel, and Sylvain Lefebvre. “PCBend: Light up Your 3D Shapes with Foldable Circuit Boards.” <i>Transactions on Graphics</i>. Association for Computing Machinery, 2023. <a href=\"https://doi.org/10.1145/3592411\">https://doi.org/10.1145/3592411</a>.","mla":"Freire, Marco, et al. “PCBend: Light up Your 3D Shapes with Foldable Circuit Boards.” <i>Transactions on Graphics</i>, vol. 42, no. 4, 142, Association for Computing Machinery, 2023, doi:<a href=\"https://doi.org/10.1145/3592411\">10.1145/3592411</a>.","ista":"Freire M, Bhargava M, Schreck C, Hugron P-A, Bickel B, Lefebvre S. 2023. PCBend: Light up your 3D shapes with foldable circuit boards. Transactions on Graphics. 42(4), 142.","short":"M. Freire, M. Bhargava, C. Schreck, P.-A. Hugron, B. Bickel, S. Lefebvre, Transactions on Graphics 42 (2023).","apa":"Freire, M., Bhargava, M., Schreck, C., Hugron, P.-A., Bickel, B., &#38; Lefebvre, S. (2023). PCBend: Light up your 3D shapes with foldable circuit boards. <i>Transactions on Graphics</i>. Los Angeles, CA, United States: Association for Computing Machinery. <a href=\"https://doi.org/10.1145/3592411\">https://doi.org/10.1145/3592411</a>"},"conference":{"name":"SIGGRAPH: Computer Graphics and Interactive Techniques Conference","end_date":"2023-08-10","start_date":"2023-08-06","location":"Los Angeles, CA, United States"},"publisher":"Association for Computing Machinery","abstract":[{"text":"We propose a computational design approach for covering a surface with individually addressable RGB LEDs, effectively forming a low-resolution surface screen. To achieve a low-cost and scalable approach, we propose creating designs from flat PCB panels bent in-place along the surface of a 3D printed core. Working with standard rigid PCBs enables the use of\r\nestablished PCB manufacturing services, allowing the fabrication of designs with several hundred LEDs. \r\nOur approach optimizes the PCB geometry for folding, and then jointly optimizes the LED packing, circuit and routing, solving a challenging layout problem under strict manufacturing requirements. Unlike paper, PCBs cannot bend beyond a certain point without breaking. Therefore, we introduce parametric cut patterns acting as hinges, designed to allow bending while remaining compact. To tackle the joint optimization of placement, circuit and routing, we propose a specialized algorithm that splits the global problem into one sub-problem per triangle, which is then individually solved.\r\nOur technique generates PCB blueprints in a completely automated way. After being fabricated by a PCB manufacturing service, the boards are bent and glued by the user onto the 3D printed support. We demonstrate our technique on a range of physical models and virtual examples, creating intricate surface light patterns from hundreds of LEDs.","lang":"eng"}],"language":[{"iso":"eng"}],"issue":"4","article_processing_charge":"No","user_id":"2DF688A6-F248-11E8-B48F-1D18A9856A87","file_date_updated":"2023-06-20T12:20:51Z","quality_controlled":"1","external_id":{"isi":["001044671300108"]},"publication":"Transactions on Graphics","ec_funded":1,"status":"public","day":"26","date_published":"2023-07-26T00:00:00Z","publication_identifier":{"issn":["0730-0301"],"eissn":["1557-7368"]},"project":[{"grant_number":"715767","_id":"24F9549A-B435-11E9-9278-68D0E5697425","call_identifier":"H2020","name":"MATERIALIZABLE: Intelligent fabrication-oriented Computational Design and Modeling"}]}