Mechanism for Si–Si bond rupture in single molecule junctions
Li H, Kim NT, Su TA, Steigerwald ML, Nuckolls C, Darancet P, Leighton JL, Venkataraman L. 2016. Mechanism for Si–Si bond rupture in single molecule junctions. Journal of the American Chemical Society. 138(49), 16159–16164.
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Journal Article
| Published
| English
Scopus indexed
Author
Li, Haixing;
Kim, Nathaniel T.;
Su, Timothy A.;
Steigerwald, Michael L.;
Nuckolls, Colin;
Darancet, Pierre;
Leighton, James L.;
Venkataraman, LathaISTA
Abstract
The stability of chemical bonds can be studied experimentally by rupturing single molecule junctions under applied voltage. Here, we compare voltage-induced bond rupture in two Si–Si backbones: one has no alternate conductive pathway whereas the other contains an additional naphthyl pathway in parallel to the Si–Si bond. We show that in contrast to the first system, the second can conduct through the naphthyl group when the Si–Si bond is ruptured using an applied voltage. We investigate this voltage induced Si–Si bond rupture by ab initio density functional theory calculations and molecular dynamics simulations that ultimately demonstrate that the excitation of molecular vibrational modes by tunneling electrons leads to homolytic Si–Si bond rupture.
Publishing Year
Date Published
2016-11-18
Journal Title
Journal of the American Chemical Society
Publisher
American Chemical Society
Volume
138
Issue
49
Page
16159-16164
ISSN
eISSN
IST-REx-ID
Cite this
Li H, Kim NT, Su TA, et al. Mechanism for Si–Si bond rupture in single molecule junctions. Journal of the American Chemical Society. 2016;138(49):16159-16164. doi:10.1021/jacs.6b10700
Li, H., Kim, N. T., Su, T. A., Steigerwald, M. L., Nuckolls, C., Darancet, P., … Venkataraman, L. (2016). Mechanism for Si–Si bond rupture in single molecule junctions. Journal of the American Chemical Society. American Chemical Society. https://doi.org/10.1021/jacs.6b10700
Li, Haixing, Nathaniel T. Kim, Timothy A. Su, Michael L. Steigerwald, Colin Nuckolls, Pierre Darancet, James L. Leighton, and Latha Venkataraman. “Mechanism for Si–Si Bond Rupture in Single Molecule Junctions.” Journal of the American Chemical Society. American Chemical Society, 2016. https://doi.org/10.1021/jacs.6b10700.
H. Li et al., “Mechanism for Si–Si bond rupture in single molecule junctions,” Journal of the American Chemical Society, vol. 138, no. 49. American Chemical Society, pp. 16159–16164, 2016.
Li H, Kim NT, Su TA, Steigerwald ML, Nuckolls C, Darancet P, Leighton JL, Venkataraman L. 2016. Mechanism for Si–Si bond rupture in single molecule junctions. Journal of the American Chemical Society. 138(49), 16159–16164.
Li, Haixing, et al. “Mechanism for Si–Si Bond Rupture in Single Molecule Junctions.” Journal of the American Chemical Society, vol. 138, no. 49, American Chemical Society, 2016, pp. 16159–64, doi:10.1021/jacs.6b10700.
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PMID: 27960303
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