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252 Publications
2023 |Published| Conference Paper | IST-REx-ID: 12976 |
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Liao, K., Tricard, T., Piovarci, M., Seidel, H.-P., & Babaei, V. (2023). Learning deposition policies for fused multi-material 3D printing. In 2023 IEEE International Conference on Robotics and Automation (Vol. 2023, pp. 12345–12352). London, United Kingdom: IEEE. https://doi.org/10.1109/ICRA48891.2023.10160465
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2023 |Published| Journal Article | IST-REx-ID: 13265 |
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Zhong, F., Xu, Y., Zhao, H., & Lu, L. (2023). As-Continuous-As-Possible extrusion-based fabrication of surface models. ACM Transactions on Graphics. Association for Computing Machinery. https://doi.org/10.1145/3575859
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2023 |Published| Journal Article | IST-REx-ID: 14041 |
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Méhes, E., Mones, E., Varga, M., Zsigmond, Á., Biri-Kovács, B., Nyitray, L., … Vicsek, T. (2023). 3D cell segregation geometry and dynamics are governed by tissue surface tension regulation. Communications Biology. Springer Nature. https://doi.org/10.1038/s42003-023-05181-7
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2023 |Published| Journal Article | IST-REx-ID: 14421 |
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Henheik, S. J., & Tumulka, R. (2023). Creation rate of Dirac particles at a point source. Journal of Physics A: Mathematical and Theoretical. IOP Publishing. https://doi.org/10.1088/1751-8121/acfe62
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| arXiv
2023 |Published| Journal Article | IST-REx-ID: 14464 |
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Ambrus, Á., Csikós, M., Kiss, G., Pach, J., & Somlai, G. (2023). Optimal embedded and enclosing isosceles triangles. International Journal of Foundations of Computer Science. World Scientific Publishing. https://doi.org/10.1142/S012905412342008X
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2023 |Published| Conference Paper | IST-REx-ID: 14691 |
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Auerbach, B., Cueto Noval, M., Pascual Perez, G., & Pietrzak, K. Z. (2023). On the cost of post-compromise security in concurrent Continuous Group-Key Agreement. In 21st International Conference on Theory of Cryptography (Vol. 14371, pp. 271–300). Taipei, Taiwan: Springer Nature. https://doi.org/10.1007/978-3-031-48621-0_10
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2023 |Published| Journal Article | IST-REx-ID: 14750 |
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Ding, X., & Ji, H. C. (2023). Local laws for multiplication of random matrices. The Annals of Applied Probability. Institute of Mathematical Statistics. https://doi.org/10.1214/22-aap1882
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2023 | Research Data | IST-REx-ID: 12817 |
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Danzl, J. G. (2023). Research data for the publication “Dense 4D nanoscale reconstruction of living brain tissue.” Institute of Science and Technology Austria. https://doi.org/10.15479/AT:ISTA:12817
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2023 |Published| Journal Article | IST-REx-ID: 13267 |
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Velicky, P., Miguel Villalba, E., Michalska, J. M., Lyudchik, J., Wei, D., Lin, Z., … Danzl, J. G. (2023). Dense 4D nanoscale reconstruction of living brain tissue. Nature Methods. Springer Nature. https://doi.org/10.1038/s41592-023-01936-6
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2023 |Published| Journal Article | IST-REx-ID: 14770
Danzl, J. G., & Velicky, P. (2023). LIONESS enables 4D nanoscale reconstruction of living brain tissue. Nature Methods. Springer Nature. https://doi.org/10.1038/s41592-023-01937-5
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2023 |Published| Journal Article | IST-REx-ID: 14775 |
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Schnelli, K., & Xu, Y. (2023). Convergence rate to the Tracy–Widom laws for the largest eigenvalue of sample covariance matrices. The Annals of Applied Probability. Institute of Mathematical Statistics. https://doi.org/10.1214/22-aap1826
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| arXiv
2023 |Published| Conference Paper | IST-REx-ID: 14768 |
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Cohen-Addad, V., Saulpic, D., & Schwiegelshohn, C. (2023). Deterministic clustering in high dimensional spaces: Sketches and approximation. In 2023 IEEE 64th Annual Symposium on Foundations of Computer Science (pp. 1105–1130). Santa Cruz, CA, United States: IEEE. https://doi.org/10.1109/focs57990.2023.00066
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2023 |Published| Journal Article | IST-REx-ID: 14788 |
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Mund, M., Tschanz, A., Wu, Y.-L., Frey, F. F., Mehl, J. L., Kaksonen, M., … Ries, J. (2023). Clathrin coats partially preassemble and subsequently bend during endocytosis. Journal of Cell Biology. Rockefeller University Press. https://doi.org/10.1083/jcb.202206038
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2023 |Published| Conference Paper | IST-REx-ID: 14798 |
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Chen, B., Jindal, A., Piovarci, M., Wang, C., Seidel, H. P., Didyk, P., … Mantiuk, R. K. (2023). The effect of display capabilities on the gloss consistency between real and virtual objects. In Proceedings of the SIGGRAPH Asia 2023 Conference. Sydney, Australia: Association for Computing Machinery. https://doi.org/10.1145/3610548.3618226
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2023 |Published| Journal Article | IST-REx-ID: 13049 |
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Freire, M., Bhargava, M., Schreck, C., Hugron, P.-A., Bickel, B., & Lefebvre, S. (2023). PCBend: Light up your 3D shapes with foldable circuit boards. Transactions on Graphics. Los Angeles, CA, United States: Association for Computing Machinery. https://doi.org/10.1145/3592411
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2023 |Published| Conference Paper | IST-REx-ID: 12979 |
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Condor, J., Piovarci, M., Bickel, B., & Didyk, P. (2023). Gloss-aware color correction for 3D printing. In SIGGRAPH ’23 Conference Proceedings. Los Angeles, CA, United States: Association for Computing Machinery. https://doi.org/10.1145/3588432.3591546
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2023 |Published| Journal Article | IST-REx-ID: 14434
He, R., Yang, L., Zhang, Y., Jiang, D., Lee, S., Horta, S., … Cabot, A. (2023). A 3d‐4d‐5d high entropy alloy as a bifunctional oxygen catalyst for robust aqueous zinc–air batteries. Advanced Materials. Wiley. https://doi.org/10.1002/adma.202303719
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2023 |Published| Book Chapter | IST-REx-ID: 17380 |
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Suzuki, S., Martin, A., Ren, Y., Chen, T.-Y., Parascho, S., & Pauly, M. (2023). BamX: Rethinking Deployability in Architecture through Weaving. In K. Dörfler, J. Knippers, A. Menges, S. Parascho, H. Pottmann, & T. Wortmann (Eds.), Advances in Architectural Geometry 2023. De Gruyter. https://doi.org/10.1515/9783111162683-016
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2023 |Published| Journal Article | IST-REx-ID: 17382
Wang, Y., Ren, Y., & Chen, T. (2023). From kirigami to hydrogels: A tutorial on designing conformally transformable surfaces. Journal of Applied Mechanics. American Society of Mechanical Engineers. https://doi.org/10.1115/1.4056350
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2023 |Published| Journal Article | IST-REx-ID: 17379
Becker, Q., Suzuki, S., Ren, Y., Pellis, D., Panetta, J., & Pauly, M. (2023). C-shells: Deployable gridshells with curved beams. ACM Transactions on Graphics. Association for Computing Machinery. https://doi.org/10.1145/3618366
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